The EX-Z13FB-R is part of the EX-Z series, which utilises new semiconductor packaging technology that does not use wire bonding to produce one of the thinnest packages available. The small unit size allows installation of sensors in a narrow space where only a conventional fibre sensor head could be installed before. The built-in amplifier also saves on installation space
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Ultra minute
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Built in amplifier
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Small object sensing capability
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Suitable for a wide range of applications
Inquiry - EX-Z13FB-R
