Features:
- Mass production equipment for anodic bonding, eutectic bonding, glass bonding, frit glass bonding, direct bonding, resin bonding, and adhesive bonding.
- We have achieved complete automation and improved mass productivity.
- Our unique heating method enables rapid heating and cooling.
- It has a structure that allows direct heating of the board and minimizes the difference between the heater temperature and the board temperature.
- High-precision alignment is possible when used in conjunction with an alignment device.
- Recipe management and data logging management via PC is available as an option.
- Anodic bonding function can be added as an option.
Inquiry - TB-60
