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Machine is specialized for the WSP (Wafer Scale Package)
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Total process System: Picking Die up from Wafer -> Quality (Appearance) Inspection and Alignment with Cameras -> Tape & Reel
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Smooth Handling of Die (No pressure or damage on Die)
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Extra small Die (up to 0.5mm square) can be applied with the Full Vision support and accurate mechanism.
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Can be applied in various ways, such as Wafer to Tape, Wafer to Tray, Tray to Tape, Tape to tape/Tray (de-taping)
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Wafer Auto laoding system is provided
Inquiry - NK8808L
